Integrated circuits are essential for modern technologies, but increasing power densities create critical thermal management challenges, including hot-spots and reduced device reliability. Conventional cooling methods are insufficient at micro- and nano-scales. This project proposes a novel cooling concept based on digital microfluidic thermal switches, where electrically actuated liquid droplets transport heat between discrete locations. This approach enables localized, on-demand heat removal with significantly reduced hydraulic losses compared to continuous flow systems. The project will develop and experimentally validate a proof-of-concept system, demonstrating a compact and efficient solution for next-generation electronic cooling, contributing to more reliable and high-performance semiconductor devices.

Keywords:

• Digital Microfluidics
• Electrowetting
• Thermal Control Elements
• Thermal Switch
• Thermal Management
• Hot Spot
• Cold Spot
• Thermal Test Vehicle
• Electronics
• Energy Conversion
• Heat Transfer