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	<title>THERMAL DIODE - Laboratory for refrigeration and district energy</title>
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	<title>THERMAL DIODE - Laboratory for refrigeration and district energy</title>
	<link>https://lahde.fs.uni-lj.si</link>
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		<title>Numerical study of macroscopic thermal diodes: influence of interface topography and contact resistance</title>
		<link>https://lahde.fs.uni-lj.si/en/numerical-study-of-macroscopic-thermal-diodes-influence-of-interface-topography-and-contact-resistance-2/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=numerical-study-of-macroscopic-thermal-diodes-influence-of-interface-topography-and-contact-resistance-2</link>
		
		<dc:creator><![CDATA[admin]]></dc:creator>
		<pubDate>Mon, 13 Oct 2025 13:02:34 +0000</pubDate>
				<category><![CDATA[PUBLICATIONS]]></category>
		<category><![CDATA[Uncategorized]]></category>
		<category><![CDATA[heat transfer]]></category>
		<category><![CDATA[THERMAL CONTROL ELEMENTS]]></category>
		<category><![CDATA[THERMAL DIODE]]></category>
		<guid isPermaLink="false">https://lahde.fs.uni-lj.si/?p=11607</guid>

					<description><![CDATA[<p>We continue our exploration of solid-state thermal diodes - a compact, fully passive asset for next-generation thermal management.<br />
Our latest paper, “Numerical study of macroscopic thermal diodes: influence of interface topography and contact resistance,” has just been published in iScience (IF 4.1).</p>
<p>The post <a href="https://lahde.fs.uni-lj.si/en/numerical-study-of-macroscopic-thermal-diodes-influence-of-interface-topography-and-contact-resistance-2/">Numerical study of macroscopic thermal diodes: influence of interface topography and contact resistance</a> first appeared on <a href="https://lahde.fs.uni-lj.si">Laboratory for refrigeration and district energy</a>.</p>]]></description>
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        <p><strong>We continue our exploration of solid-state thermal diodes</strong> &#8211; a compact, fully passive <strong>asset for next-generation thermal management</strong>.</p><p>Our latest paper, <em>“Numerical study of macroscopic thermal diodes: influence of interface topography and contact resistance,”</em> has just been published in <strong>iScience (IF 4.1)</strong>.</p><p>🔍 <strong>Key insights:</strong></p><ul><li><strong>Interface topography</strong> alone has little effect on the rectification factor when contact resistance is negligible. However, it can <strong>extend the temperature range of rectification by up to 10 K</strong>.</li></ul><p><strong>Constant contact resistance</strong> tends to reduce rectification. However, when <strong>temperature-dependent contact resistance</strong> is introduced at low temperatures, rectification can be <strong>boosted significantly.</strong> In one case, from nearly zero to nearly unity.</p><p><img data-tf-not-load="1" fetchpriority="high" loading="auto" decoding="auto" fetchpriority="high" decoding="async" src="https://lahde.fs.uni-lj.si/wp-content/uploads/2025/10/Results-1024x367.png" alt="" width="750" height="269" class="aligncenter wp-image-11600 size-large" srcset="https://lahde.fs.uni-lj.si/wp-content/uploads/2025/10/Results-1024x367.png 1024w, https://lahde.fs.uni-lj.si/wp-content/uploads/2025/10/Results-300x108.png 300w, https://lahde.fs.uni-lj.si/wp-content/uploads/2025/10/Results-768x275.png 768w, https://lahde.fs.uni-lj.si/wp-content/uploads/2025/10/Results-1536x551.png 1536w, https://lahde.fs.uni-lj.si/wp-content/uploads/2025/10/Results-2048x734.png 2048w" sizes="(max-width: 750px) 100vw, 750px" /></p><p>These findings provide <strong>new guidelines for optimizing solid-state thermal diodes</strong> and open up exciting possibilities for practical thermal management applications.</p><p><img data-tf-not-load="1" decoding="async" src="https://lahde.fs.uni-lj.si/wp-content/uploads/2025/10/MSTDs_conclusions-1024x521.png" alt="" width="750" height="382" class="aligncenter wp-image-11599 size-large" srcset="https://lahde.fs.uni-lj.si/wp-content/uploads/2025/10/MSTDs_conclusions-1024x521.png 1024w, https://lahde.fs.uni-lj.si/wp-content/uploads/2025/10/MSTDs_conclusions-300x153.png 300w, https://lahde.fs.uni-lj.si/wp-content/uploads/2025/10/MSTDs_conclusions-768x391.png 768w, https://lahde.fs.uni-lj.si/wp-content/uploads/2025/10/MSTDs_conclusions-1536x781.png 1536w, https://lahde.fs.uni-lj.si/wp-content/uploads/2025/10/MSTDs_conclusions-2048x1042.png 2048w" sizes="(max-width: 750px) 100vw, 750px" /></p>    </div>
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<!--/themify_builder_content--><p>The post <a href="https://lahde.fs.uni-lj.si/en/numerical-study-of-macroscopic-thermal-diodes-influence-of-interface-topography-and-contact-resistance-2/">Numerical study of macroscopic thermal diodes: influence of interface topography and contact resistance</a> first appeared on <a href="https://lahde.fs.uni-lj.si">Laboratory for refrigeration and district energy</a>.</p>]]></content:encoded>
					
		
		
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		<title>FisMat 2025, Venice</title>
		<link>https://lahde.fs.uni-lj.si/en/fismat-2025-venice/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=fismat-2025-venice</link>
		
		<dc:creator><![CDATA[admin]]></dc:creator>
		<pubDate>Thu, 10 Jul 2025 12:24:59 +0000</pubDate>
				<category><![CDATA[CONFERENCES]]></category>
		<category><![CDATA[Uncategorized]]></category>
		<category><![CDATA[ALTERNATIVE REFRIGERATION]]></category>
		<category><![CDATA[MAGNETOCALORICS]]></category>
		<category><![CDATA[MICROFLUIDICS]]></category>
		<category><![CDATA[refrigeration]]></category>
		<category><![CDATA[THERMAL CONTROL ELEMENTS]]></category>
		<category><![CDATA[THERMAL DIODE]]></category>
		<category><![CDATA[THERMAL SWITCH]]></category>
		<guid isPermaLink="false">https://lahde.fs.uni-lj.si/?p=11383</guid>

					<description><![CDATA[<p>At this year’s FisMat conference, held in Venice, Italy, a special workshop on cooling of electronics and sensors took place.</p>
<p>The post <a href="https://lahde.fs.uni-lj.si/en/fismat-2025-venice/">FisMat 2025, Venice</a> first appeared on <a href="https://lahde.fs.uni-lj.si">Laboratory for refrigeration and district energy</a>.</p>]]></description>
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        <p>At this year’s FisMat conference, held in Venice, Italy, a special workshop on <strong>cooling of electronics and sensors</strong> took place. As part of the workshop, <strong>Katja Klinar</strong> gave an invited talk titled <em>&#8220;Active and Passive Cooling Methods for Electronics and Sensors.&#8221;</em></p><p>The workshop provided an excellent opportunity for an in-depth look at the latest research and innovative solutions in one of the key areas of modern electronics. The high quality of the presentations, the diversity of approaches, and the engaging discussions clearly demonstrated how important and timely this field is.</p><p>Sincere thanks to the organizers for a carefully planned and content-rich workshop. It’s always encouraging to see a community so committed to progress—both in scientific understanding and practical application.</p><p>More info: <a href="https://eventi.cnism.it/fismat2025">https://eventi.cnism.it/fismat2025</a></p>    </div>
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<!--/themify_builder_content--><p>The post <a href="https://lahde.fs.uni-lj.si/en/fismat-2025-venice/">FisMat 2025, Venice</a> first appeared on <a href="https://lahde.fs.uni-lj.si">Laboratory for refrigeration and district energy</a>.</p>]]></content:encoded>
					
		
		
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		<title>TCCbuilder: an open-source tool for the analysis of thermal switches, thermal diodes, thermal regulators, and thermal control circuits</title>
		<link>https://lahde.fs.uni-lj.si/en/tccbuilder-an-open-source-tool-for-the-analysis-of-thermal-switches-thermal-diodes-thermal-regulators-and-thermal-control-circuits-2/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=tccbuilder-an-open-source-tool-for-the-analysis-of-thermal-switches-thermal-diodes-thermal-regulators-and-thermal-control-circuits-2</link>
		
		<dc:creator><![CDATA[admin]]></dc:creator>
		<pubDate>Mon, 11 Nov 2024 07:21:40 +0000</pubDate>
				<category><![CDATA[PUBLICATIONS]]></category>
		<category><![CDATA[ELASTOCALORICS]]></category>
		<category><![CDATA[ELECTROCALORICS]]></category>
		<category><![CDATA[heat transfer]]></category>
		<category><![CDATA[MAGNETOCALORICS]]></category>
		<category><![CDATA[MICROFLUIDICS]]></category>
		<category><![CDATA[THERMAL CONTROL ELEMENTS]]></category>
		<category><![CDATA[THERMAL DIODE]]></category>
		<category><![CDATA[THERMAL SWITCH]]></category>
		<category><![CDATA[THERMOELECTRICITY]]></category>
		<guid isPermaLink="false">https://lahde.fs.uni-lj.si/?p=8727</guid>

					<description><![CDATA[<p>Researchers of the LAHDE laboratory of the Faculty of Mechanical Engineering, University of Ljubljana, have developed an open-source tool for 1D  modeling of thermal control circuits, TCCbuilder.</p>
<p>The post <a href="https://lahde.fs.uni-lj.si/en/tccbuilder-an-open-source-tool-for-the-analysis-of-thermal-switches-thermal-diodes-thermal-regulators-and-thermal-control-circuits-2/">TCCbuilder: an open-source tool for the analysis of thermal switches, thermal diodes, thermal regulators, and thermal control circuits</a> first appeared on <a href="https://lahde.fs.uni-lj.si">Laboratory for refrigeration and district energy</a>.</p>]]></description>
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<p style="text-align: justify;"><span>Researchers of the LAHDE laboratory of the Faculty of Mechanical Engineering, University of Ljubljana, have developed an open-source tool for 1D  modeling of thermal control circuits, <a href="https://www.tccbuilder.org" target="_blank" style="color: blue;" rel="noopener">TCCbuilder</a>. It is the first tool of its kind that enables quick and easy modeling of thermal control circuits thanks to its graphical user interface and thr associated library of materials used to create thermal control elements.</span></p>
<p style="text-align: justify;"><span>In addition to the library of materials, there is also a library of already designed thermal control elements from the literature. Researchers from various fields are invited to complement both libraries as well as to add functionality to the tool. Thus, TCCbuilder is not only an indispensable tool for simulations, but also a platform for the exchange of information and networking of researchers in the field of heat transfer and materials.</span></p>
<p style="text-align: justify;"><span>The tool is presented in the article TCCbuilder: an open-source tool for the analysis of thermal switches, thermal diodes, thermal regulators, and thermal control circuits, which describes the validation and examples of the use of the tool. The article is published in the journal iScience (IF = 4.6), Special Issue: <a href="https://www.sciencedirect.com/special-issue/10WF4M39FP2" target="_blank" style="color: blue;" rel="noopener">Advanced thermal control: fundamentals and applications</a>.</span></p>
<p><span> </span></p>
<p><span>The article is freely accessible under the following link: <a href="https://doi.org/10.1016/j.isci.2024.111263" target="_blank" style="color: blue;" rel="noopener">https://doi.org/10.1016/j.isci.2024.111263</a></span></p>
<p><span> </span></p>
<p><span>Summary:</span></p>
<p style="text-align: justify;"><span>In the area of thermal management, thermal control elements (TCEs) and thermal control circuits (TCCs) are proving to be innovative solutions to the challenges of temperature control and heat dissipation in various applications, ranging from electronic cooling to energy conversion and temperature control in buildings. Their integration promises to improve power density, energy efficiency, system reliability and system life expectancy. With the aim of connecting researchers in the field of thermal management and accelerating the development of TCEs and TCCs, we have developed an open-source TCC simulation tool called TCCbuilder that enables a quick and easy time-dependent 1D numerical analysis of the behavior of TCEs and TCCs. It uses the heat conduction equation to solve temperature profiles in different devices. The TCCbuilder application offers features not previously available with any other TCC modelling tool: a large adjacent library of materials and TCEs as well as a user-friendly graphical user interface (GUI).</span></p>
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<!--/themify_builder_content--><p>The post <a href="https://lahde.fs.uni-lj.si/en/tccbuilder-an-open-source-tool-for-the-analysis-of-thermal-switches-thermal-diodes-thermal-regulators-and-thermal-control-circuits-2/">TCCbuilder: an open-source tool for the analysis of thermal switches, thermal diodes, thermal regulators, and thermal control circuits</a> first appeared on <a href="https://lahde.fs.uni-lj.si">Laboratory for refrigeration and district energy</a>.</p>]]></content:encoded>
					
		
		
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		<title>ARRS will (co-)finance TCCbuilder research project</title>
		<link>https://lahde.fs.uni-lj.si/en/arrs-will-co-finance-tccbuilder-research-project/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=arrs-will-co-finance-tccbuilder-research-project</link>
		
		<dc:creator><![CDATA[lahde]]></dc:creator>
		<pubDate>Wed, 13 Oct 2021 18:21:00 +0000</pubDate>
				<category><![CDATA[PUBLICATIONS]]></category>
		<category><![CDATA[Uncategorized]]></category>
		<category><![CDATA[THERMAL DIODE]]></category>
		<category><![CDATA[THERMAL SWITCH]]></category>
		<guid isPermaLink="false">https://lahde.fs.uni-lj.si/?p=6295</guid>

					<description><![CDATA[<p>The Public Research Agency of the Republic of Slovenia (ARRS) will finance a basic science project entitled TCCbuilder: An open-source simulation tool for thermal control circuits. The project was selected together with 12 other projects of the Faculty of Mechanical Engineering UL.The project concerns the development of World’s first numerical<a class="moretag" href="https://lahde.fs.uni-lj.si/en/arrs-will-co-finance-tccbuilder-research-project/"> Read more&#8230;</a></p>
<p>The post <a href="https://lahde.fs.uni-lj.si/en/arrs-will-co-finance-tccbuilder-research-project/">ARRS will (co-)finance TCCbuilder research project</a> first appeared on <a href="https://lahde.fs.uni-lj.si">Laboratory for refrigeration and district energy</a>.</p>]]></description>
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        <p></p><p>The Public Research Agency of the Republic of Slovenia (ARRS) will finance a basic science project entitled TCCbuilder: An open-source simulation tool for thermal control circuits. The project was selected together with 12 other projects of the Faculty of Mechanical Engineering UL.</p><p>The project concerns the development of World’s first numerical tool for simulation of new thermal management principles, analogous to electronic devices, which aim to solve the increasing demand for high energy efficiency, optimal performance and ultrahigh power density of micro- and power-  electronics, energy conversion processes and devices.</p><p>The traditional way of thermal management concerns basic principles of heat transfer applied via heat radiation, conduction and convection. In relatively large systems, extended surfaces, heat pipes, phase change fluids, fans, or hydraulic circuits are applied. However, the ever-improving knowledge on nano- to microscopic systems brings substantially higher power densities, with potentially transient,  fluctuating or migrating hot or cold spots, and thus new requirements for thermal management.</p><p>With the improving knowledge in solid state physics and material science, new fundamental principles in thermal sciences have been discovered, which can lead to tuneable thermal properties of materials. Both, the solids and fluids can be tailored into different types of thermal control elements: thermal conduits, thermal resistors, thermal switches, thermal regulators, thermal diodes and thermal capacitors. These elements can manage heat in a manner analogous to how electronic devices control electricity. They can store, block, rectify, guide and control the intensity of heat flux or its direction. By combining these elements into integrated circuits new thermal management principles can be established in different applications, from thermal management of energy conversion devices in space,</p><p>sensors and detection systems, devices which deal with thermally sensitive biological tissues, to energy conversion and thermal energy storage systems, including the power train. In the most straightforward direction of applications, thermal control elements (TCEs) and circuits represent an important part of future’s thermal management of (micro)electronic devices and systems. However, our understanding of thermal control elements is at the very beginning, and the thermal control circuits have not been yet developed.</p><p>To develop thermal circuits toward realistic applications, the knowledge on potential materials, mechanisms, and coupling phenomena is strongly required. To bring the existing and new knowledge into realistic devices, it is indispensable to develop the World’s first open source numerical tool for simulation and evaluation of thermal control elements and thermal control circuits, before they can be tested in real environment. The main goal of this project is to develop such open source numerical tool with constantly updated library of materials or composites (their properties), and TCEs (their features), as well as with the possibility to form, design and evaluate thermal control and thermal logic circuits. Because of the broadness of the research field, the first version of the tool will be dedicated to numerical analysis of potential solid-state refrigeration systems, heat pumping and power generation on a small scale, and solid-state thermal management of power- and micro-electronic devices. The tool will be developed in a manner that will enable later upgrading with other types of systems, such as (micro)fluidic thermal management systems, micro-cooling and heat pump systems based on gases or liquids. Therefore, later versions of the tool are expected to enable much larger spectrum of potential applications.</p><p>The tool will represent a ground basis for the evaluation of transient and steady state features of newly tailored designs. It will serve as a solid foundation for researchers dealing with thermal management, as well as a platform that will connect researchers from different fields (e.g. material science, chemical, electrical and mechanical engineering, solid state physics). Each user will be able to add characteristics of their TCEs into the tool’s library to share experiences and gained knowledge with others.</p>    </div>
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<!--/themify_builder_content--><p>The post <a href="https://lahde.fs.uni-lj.si/en/arrs-will-co-finance-tccbuilder-research-project/">ARRS will (co-)finance TCCbuilder research project</a> first appeared on <a href="https://lahde.fs.uni-lj.si">Laboratory for refrigeration and district energy</a>.</p>]]></content:encoded>
					
		
		
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		<title>Thermal rectification using multi-layered materials</title>
		<link>https://lahde.fs.uni-lj.si/en/thermal-rectification-using-multi-layered-materials/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=thermal-rectification-using-multi-layered-materials</link>
		
		<dc:creator><![CDATA[lahde]]></dc:creator>
		<pubDate>Wed, 11 Aug 2021 09:07:41 +0000</pubDate>
				<category><![CDATA[PUBLICATIONS]]></category>
		<category><![CDATA[Uncategorized]]></category>
		<category><![CDATA[THERMAL DIODE]]></category>
		<category><![CDATA[THERMAL SWITCH]]></category>
		<guid isPermaLink="false">https://lahde.fs.uni-lj.si/?p=6145</guid>

					<description><![CDATA[<p>A paper on increasing thermal rectification using multi-layered materials has been published in collaboration with colleagues from the University of Twente. The article was published in the journal iScience.</p>
<p>The post <a href="https://lahde.fs.uni-lj.si/en/thermal-rectification-using-multi-layered-materials/">Thermal rectification using multi-layered materials</a> first appeared on <a href="https://lahde.fs.uni-lj.si">Laboratory for refrigeration and district energy</a>.</p>]]></description>
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<p>A paper on increasing thermal rectification using multi-layered materials has been published in collaboration with colleagues from the University of Twente. The article was published in the journal iScience.<o:p></o:p></p>
<p>The paper is available here: <a href="https://www.sciencedirect.com/science/article/pii/S2589004221008117">https://www.sciencedirect.com/science/article/pii/S2589004221008117</a><o:p></o:p></p>
<p></p>
<p>Abstract<o:p></o:p></p>
<div id="abssec0010">
<p id="abspara0010"><span>Solid-state thermal control devices that present an asymmetric heat flow depending on thermal bias <a href="https://www.sciencedirect.com/topics/engineering/directionality" title="Learn more about directionality from ScienceDirect's AI-generated Topic Pages" class="topic-link">directionality</a>, referred to as thermal diodes, have recently received increased attention for energy management. The use of materials that can change phase is a common approach to design thermal diodes, but typical sizes, moderate </span><a href="https://www.sciencedirect.com/topics/engineering/rectification" title="Learn more about rectification from ScienceDirect's AI-generated Topic Pages" class="topic-link">rectification</a><span> ratios, and narrow thermal tunability limit their potential applications. In this work, we propose a <a href="https://www.sciencedirect.com/topics/chemistry/multilayer" title="Learn more about multilayer from ScienceDirect's AI-generated Topic Pages" class="topic-link">multilayer</a> thermal diode made of a combination of phase change and invariant materials. This device presents state-of-the-art thermal <a href="https://www.sciencedirect.com/topics/engineering/rectification-ratio" title="Learn more about rectification ratios from ScienceDirect's AI-generated Topic Pages" class="topic-link">rectification ratios</a> up to 136% for a temperature range between 300 K and 500 K. Importantly, this design allows to switch between distinct rectification states that can be modulated with temperature, achieving an additional degree of thermal control compared with single-rectification-state devices. We analyze the relevance of our thermal diodes for retaining heat more efficiently in <a href="https://www.sciencedirect.com/topics/engineering/thermal-energy-storage" title="Learn more about thermal storage from ScienceDirect's AI-generated Topic Pages" class="topic-link">thermal storage</a> elements.</span></p>
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		<title>CHC Caloric Heating and Cooling seminar, Twente 2020</title>
		<link>https://lahde.fs.uni-lj.si/en/chc-caloric-heating-and-cooling-seminar-twente-2020-2/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=chc-caloric-heating-and-cooling-seminar-twente-2020-2</link>
		
		<dc:creator><![CDATA[lahde]]></dc:creator>
		<pubDate>Wed, 28 Jul 2021 05:16:22 +0000</pubDate>
				<category><![CDATA[CONFERENCES]]></category>
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		<category><![CDATA[Uncategorized]]></category>
		<category><![CDATA[ELASTOCALORICS]]></category>
		<category><![CDATA[HEAT EXCHANGERS]]></category>
		<category><![CDATA[heat transfer]]></category>
		<category><![CDATA[MAGNETOCALORICS]]></category>
		<category><![CDATA[THERMAL DIODE]]></category>
		<category><![CDATA[THERMAL SWITCH]]></category>
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					<description><![CDATA[<p> Eurotherm CHC (Caloric Heating and Cooling) 2020 is another scientific seminar that was postponed from last year to 2021. It took place virtually between 13 and 15 July. The LAHDE laboratory participated in 4 conference papers and an invited lecture:Cool future: magnetocaloric devices based on static and rare earth free<a class="moretag" href="https://lahde.fs.uni-lj.si/en/chc-caloric-heating-and-cooling-seminar-twente-2020-2/"> Read more&#8230;</a></p>
<p>The post <a href="https://lahde.fs.uni-lj.si/en/chc-caloric-heating-and-cooling-seminar-twente-2020-2/">CHC Caloric Heating and Cooling seminar, Twente 2020</a> first appeared on <a href="https://lahde.fs.uni-lj.si">Laboratory for refrigeration and district energy</a>.</p>]]></description>
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        <p> </p><p>Eurotherm CHC (Caloric Heating and Cooling) 2020 is another scientific seminar that was postponed from last year to 2021. It took place virtually between 13 and 15 July. The LAHDE laboratory participated in 4 conference papers and an invited lecture:</p><ul><li>Cool future: magnetocaloric devices based on static and rare earth free <br />magnetic field sources (Urban Tomc, Stefano Dall&#8217;Olio, Katja Klinar, Simon Nosan, Urška Erjavec, Matej Šadl, Hana Uršič, Andrej Kitanovski)</li><li><span role="presentation" dir="ltr">New concept of electromagnetic field source for magnetic refrigeration (Simon Nosan, Urban Tomc, Katja Klinar, Andrej Kitanovski)</span><span role="presentation" dir="ltr"></span></li><li>Numerical tool for evaluation of static thermal switches in caloric <br />refrigeration and heat pumping (Katja Klinar, Katja Vozel, Andrej Kitanovski)</li><li>Elastocaloric materials for active cooling regenerators (Lucia Ianniciello, Jaka Tušek, Lluid Manosa, Eduard Vives, Kurt Engelbrecht)</li><li>Thermo-hydraulic analysis of shell-and-tube-like geometries for <br />elastocaloric regenerators (Žiga Ahčin, Jierong Liang, Kurt Englebrecht, Jaka Tušek)</li></ul><p>Seminar information: <a href="https://eurotherm.et.utwente.nl/#page">https://eurotherm.et.utwente.nl/#page</a></p>    </div>
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		<title>2021 Virtual Spring Meeting &#038; Exhibit</title>
		<link>https://lahde.fs.uni-lj.si/en/2021-virtual-spring-meeting-exhibit/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=2021-virtual-spring-meeting-exhibit</link>
		
		<dc:creator><![CDATA[lahde]]></dc:creator>
		<pubDate>Tue, 04 May 2021 07:12:04 +0000</pubDate>
				<category><![CDATA[CONFERENCES]]></category>
		<category><![CDATA[MAGNETOCALORICS]]></category>
		<category><![CDATA[THERMAL DIODE]]></category>
		<category><![CDATA[THERMAL SWITCH]]></category>
		<guid isPermaLink="false">https://lahde.fs.uni-lj.si/?p=5969</guid>

					<description><![CDATA[<p>Due to coronavirus epidemic, MRS ( Material Research Society ) Spring Meeting was again held virtually. Together with the research group from Twente Univeristy we presented thermal rectification with multilayer phase change materials: High Asymmetric Heat Transport in Multilayer Phase Change Materials. Apart from the lack of personal contact, pastries<a class="moretag" href="https://lahde.fs.uni-lj.si/en/2021-virtual-spring-meeting-exhibit/"> Read more&#8230;</a></p>
<p>The post <a href="https://lahde.fs.uni-lj.si/en/2021-virtual-spring-meeting-exhibit/">2021 Virtual Spring Meeting & Exhibit</a> first appeared on <a href="https://lahde.fs.uni-lj.si">Laboratory for refrigeration and district energy</a>.</p>]]></description>
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<p>Due to coronavirus epidemic, MRS ( Material Research Society ) Spring Meeting was again held virtually.</p>
<p>Together with the research group from Twente Univeristy we presented thermal rectification with multilayer phase change materials: <em><span dir="ltr">High Asymmetric Heat Transport in Multilayer Phase Change Materials</span>.</em></p>
<p>Apart from the lack of personal contact, pastries during the coffee breaks and the exchange of business cards, the virtual conference also had some advantages:</p>
<p>– lectures were recorded in advance, viewing was possible on demand,<br />– content was available online for a longer period of time than the conference itself,<br />– main events were still live,<br />– entertainment was provided.</p>
<p>This method allows each attendee to set their own schedule and view multiple presentations, including those from concurrent sections. However, we hope to have as few virtual conferences as possible.</p>
</div>
<p>Abstract:</p>
<p><strong><span dir="ltr">High Asymmetric Heat Transport in Multilayer Phase Change Materials</span></strong><span dir="ltr"> </span></p>
<p><span dir="ltr">Timm Swoboda</span><span dir="ltr">1</span><span dir="ltr">, Katja <span class="highlight selected">Klinar</span></span><span dir="ltr">2</span><span dir="ltr">, Andrej Kitanovski</span><span dir="ltr">2</span><span dir="ltr"> and Miguel Muñoz </span><span dir="ltr">Rojo</span><span dir="ltr">1</span><span dir="ltr">; </span></p>
<p><span dir="ltr">1</span><span dir="ltr">University of Twente, Netherlands; </span><span dir="ltr">2</span><span dir="ltr">University of Ljubljana, Slovenia</span></p>
<p><span dir="ltr"> </span><span dir="ltr">In this work, we determine how a multilayer structure made of different types of nanoscale phase change materials results in a highly non-linear and </span><span dir="ltr">asymmetric heat flow depending on thermal bias directionality. This will set the basis of solid-state thermal diodes that can be scaled up for integration in </span><span dir="ltr">energy management, conversion or storage applications. Thermal diodes (TD) or rectifiers are capable to manage heat in a similar manner as how </span><span dir="ltr">electronic diodes control electricity, propagating heat preferably in one direction.</span><span dir="ltr">[1]</span><span dir="ltr"> The rectification ratio is defined as, </span><span dir="ltr">RR</span><span dir="ltr"> = (</span><span dir="ltr">Q</span><span dir="ltr">fwd</span><span dir="ltr">–</span><span dir="ltr">Q</span><span dir="ltr">rev</span><span dir="ltr">)/</span><span dir="ltr">Q</span><span dir="ltr">rev</span><span dir="ltr">, </span><span dir="ltr">where </span><span dir="ltr">Q</span><span dir="ltr">fwd</span><span dir="ltr"> and </span><span dir="ltr">Q</span><span dir="ltr">rev</span><span dir="ltr"> correspond to the heat flux in the forward and reverse direction, respectively. Unfortunately, current solid-state thermal diodes </span><span dir="ltr">typically present moderate </span><span dir="ltr">RR</span><span dir="ltr">s, complex fabrication designs, and/or lack of operating temperature tuneability.</span><span dir="ltr">[1]</span></p>
<p><span dir="ltr">Phase change materials (PCM) have become popular for the development of TDs due to their thermal conductivity (</span><span dir="ltr">k</span><span dir="ltr">) change during the phase transition at </span><span dir="ltr">a critical temperature (</span><span dir="ltr">T</span><span dir="ltr">crit</span><span dir="ltr">), e.g. VO</span><span dir="ltr">2 </span><span dir="ltr">(</span><span dir="ltr">k</span><span dir="ltr">low</span><span dir="ltr"> =</span><span dir="ltr"> 1.5 W/(m×K) to </span><span dir="ltr">k</span><span dir="ltr">high</span><span dir="ltr"> = 3.5 W/(m×K) at </span><span dir="ltr">T</span><span dir="ltr">crit</span><span dir="ltr">~</span><span dir="ltr">340 K).</span><span dir="ltr">[1,2]</span><span dir="ltr"> These materials are often combined with phase </span><span dir="ltr">invariant materials (PIM) to develop TDs.</span><span dir="ltr">[1]</span><span dir="ltr"> As an example, in a PIM/PCM structure based on VO</span><span dir="ltr">2</span><span dir="ltr">, when the heat source is at temperatures </span><span dir="ltr">T</span><span dir="ltr">&gt;</span><span dir="ltr"> T</span><span dir="ltr">crit</span><span dir="ltr"> and </span><span dir="ltr">close to the PCM side, both PIM and PCM conduct the heat well (</span><span dir="ltr">Q</span><span dir="ltr">fwd</span><span dir="ltr">). The situation is reversed when the heat source is applied to the PIM (</span><span dir="ltr">Q</span><span dir="ltr">rev</span><span dir="ltr">). This </span><span dir="ltr">typically leads to </span><span dir="ltr">RR</span><span dir="ltr"> larger than those found for individual PCMs.</span><span dir="ltr">[1]</span></p>
<p><span dir="ltr">Here, we used finite element modeling (COMSOL®) to develop a versatile TD based on a novel multilayer PCM/PIM structure. Our design includes an </span><span dir="ltr">alternating combination of two PCM layers with two PIM layers. The total length of the multilayer structure was set to 1 μm, while the thickness of the </span><span dir="ltr">individual layers was varied at the nanoscale. We selected carefully different types of PCM and PIM materials, whose experimental thermal properties </span><span dir="ltr">were extracted from literature, to find the optimum PCM/PIM configuration that led to the highest </span><span dir="ltr">RR</span><span dir="ltr">. Then, we applied a temperature difference across </span><span dir="ltr">the two ends of this structure. </span><span dir="ltr">RRs</span><span dir="ltr"> larger than 100% were observed when we used Si and SiO</span><span dir="ltr">2</span><span dir="ltr"> as PIMs and Ag</span><span dir="ltr">2</span><span dir="ltr">Te and Ag</span><span dir="ltr">2</span><span dir="ltr">S</span><span dir="ltr">0.6</span><span dir="ltr">Se</span><span dir="ltr">0.4</span><span dir="ltr"> as PCMs with transition </span><span dir="ltr">temperatures at 420 K and 360 K, respectively.</span><span dir="ltr">[3]</span><span dir="ltr"> Compared to the state of the art</span><span dir="ltr">[1]</span><span dir="ltr"> of PCM/PIM diodes, this configuration represents one of the </span><span dir="ltr">highest </span><span dir="ltr">RRs</span><span dir="ltr"> at room temperature as well as offers new possibilities for advanced thermal control. Additionally, from the point of view of applicability, this </span><span dir="ltr">thermal diode offers numerous advantages over previously reported TDs, including simple design, scalability and operating temperature tunability. </span></p>
<p><span dir="ltr">To determine the potential of this thermal device for solid state refrigeration, we analyzed the effect of integrating this TD into a magnetocaloric (MC) </span><span dir="ltr">device. For that purpose, we used a one-dimensional MC device consisting of gadolinium as MC material with two TDs at their ends, sandwiched between </span><span dir="ltr">the heat sink and the heat source. The presence of TDs avoids the heat to flow back to the heat source improving the efficiency of the MC device.</span><span dir="ltr">[4]</span><span dir="ltr"> We </span><span dir="ltr">selected a PIM/PCM structure that worked optimally for the MC system operating temperature and we considered quasi-steady-state operation in an </span><span dir="ltr">alternating magnetic field with 1 T change. We observed that the integration of this TD enables higher operating frequencies compared to the conventional </span><span dir="ltr">active magnetic regeneration process, increasing the cooling power density. Beyond MC refrigeration, this versatile and unique TD can be used in other </span><span dir="ltr">solid state refrigeration, heat pump and energy harvesting technologies to improve their performances or efficiencies.</span><span dir="ltr">[1,4]</span></p>
<p><span dir="ltr">References</span></p>
<p><span dir="ltr">[1] Swoboda </span><span dir="ltr">et al.</span><span dir="ltr">, </span><span dir="ltr">Adv. Electron. Mater.</span><span dir="ltr">, </span><span dir="ltr">2021, </span><span dir="ltr"> DOI: 10.1002/aelm.202000625 </span></p>
<p><span dir="ltr">[2] Oh </span><span dir="ltr">et al.</span><span dir="ltr">, </span><span dir="ltr">Appl. Phys. Lett.</span><span dir="ltr">, </span><span dir="ltr">96</span><span dir="ltr">, </span><span dir="ltr">2010</span></p>
<p><span dir="ltr">[3] Hirata </span><span dir="ltr">et al</span><span dir="ltr">., </span><span dir="ltr">J. Electron. Mater.</span><span dir="ltr">, </span><span dir="ltr">49</span><span dir="ltr">, </span><span dir="ltr">2020</span></p>
<p><span dir="ltr">[4] Kitanovski, </span><span dir="ltr">Adv. Energy Mater.</span><span dir="ltr">, </span><span dir="ltr">10</span><span dir="ltr">, </span><span dir="ltr">2020</span></p>
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		<title>Fluidic and mechanical thermal control devices</title>
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		<dc:creator><![CDATA[lahde]]></dc:creator>
		<pubDate>Thu, 24 Dec 2020 11:08:27 +0000</pubDate>
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		<category><![CDATA[ELASTOCALORICS]]></category>
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		<category><![CDATA[MAGNETOCALORICS]]></category>
		<category><![CDATA[THERMAL DIODE]]></category>
		<category><![CDATA[THERMAL SWITCH]]></category>
		<guid isPermaLink="false">https://lahde.fs.uni-lj.si/?p=5910</guid>

					<description><![CDATA[<p>An extensive review of thermal management with fluidic and mechanical thermal control devices has been published in collaboration with colleagues from the University of Twente (Dr. Miguel Muñoz Rojo and Timm Swoboda). A review article published in the journal Advanced electronic materials (published by Wiley) presents the second of two<a class="moretag" href="https://lahde.fs.uni-lj.si/en/fluidic-and-mechanical-thermal-control-devices/"> Read more&#8230;</a></p>
<p>The post <a href="https://lahde.fs.uni-lj.si/en/fluidic-and-mechanical-thermal-control-devices/">Fluidic and mechanical thermal control devices</a> first appeared on <a href="https://lahde.fs.uni-lj.si">Laboratory for refrigeration and district energy</a>.</p>]]></description>
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        <p>An extensive review of thermal management with fluidic and mechanical thermal control devices has been published in collaboration with colleagues from the University of Twente (Dr. Miguel Muñoz Rojo and Timm Swoboda). A review article published in the journal Advanced electronic materials (published by Wiley) presents the second of two parts of a review of thermal control devices.</p>
<p>The paper is available here: https://onlinelibrary.wiley.com/doi/10.1002/aelm.202000623</p>
<p>Abstract</p>
<p>In recent years, intensive studies on thermal control devices have been conducted for the thermal management of electronics and computers as well as for applications in energy conversion, chemistry, sensors, buildings, and outer space. Conventional cooling or heating techniques realized using traditional thermal resistors and capacitors cannot meet the thermal requirements of advanced systems. Therefore, new thermal control devices are being investigated to satisfy these requirements. These devices include thermal diodes, thermal switches, thermal regulators, and thermal transistors, all of which manage heat in a manner analogous to how electronic devices and circuits control electricity. To design or apply these novel devices as well as thermal control principles, this paper presents a systematic and comprehensive review of the state‐of‐the‐art of fluidic and mechanical thermal control devices that have already been implemented in various applications for different size scales and temperature ranges. Operation principles, working parameters, and limitations are discussed and the most important features for a particular device are identified.</p>    </div>
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		<title>Solid-state thermal control devices</title>
		<link>https://lahde.fs.uni-lj.si/en/solid-state-thermal-control-devices/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=solid-state-thermal-control-devices</link>
		
		<dc:creator><![CDATA[lahde]]></dc:creator>
		<pubDate>Wed, 09 Dec 2020 06:43:49 +0000</pubDate>
				<category><![CDATA[PUBLICATIONS]]></category>
		<category><![CDATA[Uncategorized]]></category>
		<category><![CDATA[MAGNETOCALORICS]]></category>
		<category><![CDATA[THERMAL DIODE]]></category>
		<category><![CDATA[THERMAL SWITCH]]></category>
		<guid isPermaLink="false">https://lahde.fs.uni-lj.si/?p=5869</guid>

					<description><![CDATA[<p>An extensive review of thermal management with thermal control devices based on solid-state physics phenomena has been published in collaboration with colleagues from the Universities of Twente (Dr. Miguel Muñoz Rojo and Timm Swoboda) and Stanford (Dr. Ananth Saran Yalamarthy). A review article published in the journal Advanced electronic materials<a class="moretag" href="https://lahde.fs.uni-lj.si/en/solid-state-thermal-control-devices/"> Read more&#8230;</a></p>
<p>The post <a href="https://lahde.fs.uni-lj.si/en/solid-state-thermal-control-devices/">Solid-state thermal control devices</a> first appeared on <a href="https://lahde.fs.uni-lj.si">Laboratory for refrigeration and district energy</a>.</p>]]></description>
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        <p>An extensive review of thermal management with thermal control devices based on solid-state physics phenomena has been published in collaboration with colleagues from the Universities of Twente (Dr. Miguel Muñoz Rojo and Timm Swoboda) and Stanford (Dr. Ananth Saran Yalamarthy). A review article published in the journal Advanced electronic materials (published by Wiley) presents the first of two parts of a review of thermal control devices.</p>
<p>The paper is available here:</p>
<p>
https://onlinelibrary.wiley.com/doi/10.1002/aelm.202000625
</p>
<p>Over the past decade, solid‐state thermal control devices have emerged as potential candidates for enhanced thermal management and storage. They distinguish themselves from traditional passive thermal management devices in that their thermal properties have sharp, nonlinear dependencies on direction and operating temperature, and can lead to more efficient circuits and energy conversion systems than what is possible today. They also distinguish themselves from traditional active thermal management devices (e.g., fans) in that they have no moving parts and are compact and reliable. In this article, the recent progress in the four broad categories of solid‐state thermal control devices that are under active research is reviewed: diodes, switches, regulators, and transistors. For each class of device, the operation principle, material choices, as well as metrics to compare and contrast performance are discussed. New architectures that are explored theoretically, but not experimentally demonstrated, are also discussed.</p>
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		<title>Virtual Spring/Fall MRS 2020 meeting</title>
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		<dc:creator><![CDATA[lahde]]></dc:creator>
		<pubDate>Tue, 01 Dec 2020 10:53:00 +0000</pubDate>
				<category><![CDATA[CONFERENCES]]></category>
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		<guid isPermaLink="false">https://lahde.fs.uni-lj.si/?p=5900</guid>

					<description><![CDATA[<p>The new coronavirus epidemic has caused most conferences to be canceled or postponed. The MRS ( Material Research Society ) usually organizes two researcher meetings a year &#8211; in the spring and in the fall. This year, both meetings were held in virtual form via a special platform at the<a class="moretag" href="https://lahde.fs.uni-lj.si/en/virtual-spring-fall-mrs-2020-meeting/"> Read more&#8230;</a></p>
<p>The post <a href="https://lahde.fs.uni-lj.si/en/virtual-spring-fall-mrs-2020-meeting/">Virtual Spring/Fall MRS 2020 meeting</a> first appeared on <a href="https://lahde.fs.uni-lj.si">Laboratory for refrigeration and district energy</a>.</p>]]></description>
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        <p>The new coronavirus epidemic has caused most conferences to be canceled or postponed. The MRS ( Material Research Society ) usually organizes two researcher meetings a year &#8211; in the spring and in the fall. This year, both meetings were held in virtual form via a special platform at the end of November.</p>
<p>At the conference, Prof. Kitanovski gave an invited presentation entitled Thermal control elements for caloric technologies.</p>
<p>Apart from the lack of personal contact, pastries during the coffee breaks and the exchange of business cards, the virtual conference also had some advantages:</p>
<p>&#8211; lectures were recorded in advance, viewing was possible on demand,<br />&#8211; content was available online for a longer period of time than the conference itself,<br />&#8211; main events were still live,<br />&#8211; entertainment was provided.</p>
<p>This method allows each attendee to set their own schedule and view multiple presentations, including those from concurrent sections. However, we hope to have as few virtual conferences as possible.</p>    </div>
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<!--/themify_builder_content--><p>The post <a href="https://lahde.fs.uni-lj.si/en/virtual-spring-fall-mrs-2020-meeting/">Virtual Spring/Fall MRS 2020 meeting</a> first appeared on <a href="https://lahde.fs.uni-lj.si">Laboratory for refrigeration and district energy</a>.</p>]]></content:encoded>
					
		
		
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